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Broadwell is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick-tock principle as the next step in semiconductor fabrication. Unlike the previous tick-tock iterations, Broadwell will not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there will be no low-end desktop CPUs based on Broadwell.〔(【引用サイトリンク】title=Lower-end desktop CPUs won’t get Broadwell, will need to wait for Skylake )〕 For the Intel Core processors based on Broadwell, they are marketed as 5th generation Core i5 and i7, there being no Core i3 based on Broadwell. This was the microarchitecture to introduce the Core M processor. Broadwell's H and C variants will be used in conjunction with Intel 9 Series chipsets (Z97, H97 and HM97), in addition to retaining backward compatibility with some of the Intel 8 Series chipsets. == Design == Broadwell has been launched in three major variants:〔(【引用サイトリンク】title=Intel Broadwell Production Plan Leaked – BDW-H Delayed To May 2015 )〕 * BGA package: * * ''Broadwell-Y'': system on a chip (SoC); 4.5 W and 3.5 W thermal design power (TDP) classes, for tablets and certain ultrabook-class implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600.〔 These will be the first chips to roll out, and are expected for Q3/Q4 2014. At Computex 2014, Intel announced that these chips will be branded as ''Core M''. * * ''Broadwell-U'': SoC; two TDP classes 15 W for 2+2 and 2+3 configurations (two cores with a GT2 or GT3 GPU) as well as 28 W for 2+3 configurations.〔(【引用サイトリンク】title=Intel Broadwell GPUs to use HD 5x00, Iris 6100 and Iris Pro 6200 branding )〕 Designed to be used on motherboards with the PCH-LP chipset for Intel's ultrabook and NUC platforms. Maximum supported is up to 16 GB of DDR3 or LPDDR3 memory, with DDR3-1600 and LPDDR3-1867 as the maximum memory speeds. The 2+2 configuration is scheduled for Q4 2014, while the 2+3 is estimated for Q1 2015.〔 For Broadwell-U models with integrated 5x00 GPUs, die size is 82 mm2 with a total of 1.3 billion transistors, while for the models with 6100 and 6200 GPUs the die size is 133 mm2 with a total of 1.9 billion transistors. * * ''Broadwell-H'': 37 W and 47 W TDP classes, for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems, mini-ITX form-factor motherboards, and other small footprint formats. It may come in two different variants, as single and dual chips; the dual chips (4 cores, 8 threads) will have GT3e and GT2 GPU, while a single chip (SoC; two cores, four threads) will have GT3e GPU. Maximum supported memory is 32 GB of DDR3-1600.〔(【引用サイトリンク】title=Intel’s 14nm Process ‘Broadwell’ Lineup Details Leaked )〕 These are scheduled for Q2 2015.〔 * LGA 1150 socket: * * ''Broadwell-DT'': quad-core unlocked desktop version with GT3e integrated graphics (Iris Pro 6200) and 128 MB of eDRAM L4 cache, in a 65 W TDP class. Announced to be backward compatible with the LGA 1150 motherboards designed for Haswell processors. * LGA 2011-v3 socket: * * ''Broadwell-EP'': to be marketed as Xeon E5-2600 v4 etc., while using the C610 Wellsburg chipset platform. Up to 22 cores and 44 threads, up to 55 MB of total cache and 40 PCI Express 3.0 lanes, with 55–160 W TDP classes. Maximum supported memory speed is quad-channel DDR4-2400. * * ''Broadwell-EX'': ''Brickland'' platform, for mission-critical servers. Intel QuickPath Interconnect (QPI) is expected to be updated to version 1.1, enabling seamless scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be DDR3-1600 and DDR4-1866. Up to 24 core and 48 threads, up to 60 MB of L3 cache and 32 PCI Express 3.0 lanes, with 115–165 W TDP. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Broadwell (microarchitecture)」の詳細全文を読む スポンサード リンク
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